On July 16, 2003, industry will hold a Flats Summit meeting in Washington, DC, to begin a closer dialog with the U. S. Postal Service concerning its future flats strategies (including delivery point sequencing of flats and delivery point packaging of letters and flats) and the impact of those strategies on the mailing industry.

¨Industry Perspective on Flats—What kind of pieces make up the flats mailstream of today...and tomorrow; industry trends and why mailpiece design and differentiation are important; the potential impacts of the USPS’ flats strategies on companies and consumers, and more...

¨ USPS Corporate Flats Strategy—Update from the USPS on its corporate flats strategy, time frames, decision factors, future process, tie-in with NIA and Product Redesign, and more…

¨Highest Combined Returns vs Lowest Combined Costs—Exploring the economics of USPS cost savings through flats automation and the impact on flats volume/revenue growth, and more…

¨The State of Technology—Mail producers and equipment manufacturers discuss the capabilities and limitations of flats handling equipment; the USPS R&D process for new processing equipment and recommended improvements; and more…

¨What Comes Next?—Development of a joint Industry/USPS action plan to pursue issues identified during the summit

Demand to attend this conference has almost exceeded our ability to admit any additional registrants. Shortly, registration for this conference will be closed.

Nonetheless, the sessions will be recorded and cassette recordings of the Summit proceedings will be available for sale. If you would like to purchase a set of these cassettes, just fill out the form noted below and send it to the PostCom office by mail (1901 N. Fort Myer Dr., Ste. 401, Arlington, VA 22209-1609), by fax (703-524-1871), or by email (cmiller@postcom.org).